Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process
This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | article |
| Language: | English |
| Published: |
2017
|
| Online Access: | https://knepublishing.com/index.php/KnE-Engineering/article/view/1111 http://ridda2.utp.ac.pa/handle/123456789/4347 |
| Tags: |
No Tags, Be the first to tag this record!
|
| _version_ | 1869652476444016640 |
|---|---|
| author | A.E., Kurnosenko |
| author2 | D.I., Arabov |
| author2_role | author |
| author_browse | A.E., Kurnosenko D.I., Arabov |
| author_facet | A.E., Kurnosenko D.I., Arabov |
| author_role | author |
| collection | Repositorio Institucional de documento digitales de acceso abierto de la UTP |
| dc.contributor.none.fl_str_mv | |
| dc.creator.none.fl_str_mv | A.E., Kurnosenko D.I., Arabov |
| dc.date.none.fl_str_mv | 2017-10-16 2018-02-23T17:16:28Z 2018-02-23T17:16:28Z |
| dc.format.none.fl_str_mv | application/pdf application/msword application/pdf application/xml |
| dc.identifier.none.fl_str_mv | https://knepublishing.com/index.php/KnE-Engineering/article/view/1111 10.18502/keg.v2i3.1111 http://ridda2.utp.ac.pa/handle/123456789/4347 http://ridda2.utp.ac.pa/handle/123456789/4347 |
| dc.language.none.fl_str_mv | eng |
| dc.publisher.none.fl_str_mv | KnE Publishing |
| dc.relation.none.fl_str_mv | https://knepublishing.com/index.php/KnE-Engineering/article/view/1111/2640 |
| dc.rights.none.fl_str_mv | info:eu-repo/semantics/openAccess https://creativecommons.org/licenses/by/4.0/ |
| dc.source.none.fl_str_mv | 2518-6841 KnE Engineering; Breakthrough directions of Scientific Research in NRNU MEPhI: Development Perspectives in the Framework of the Strategic reponame:Repositorio Institucional de documento digitales de acceso abierto de la UTP instname:Universidad Tecnológica de Panamá instacron:U Tecnológica de Panamá |
| dc.title.none.fl_str_mv | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process |
| dc.type.none.fl_str_mv | info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion |
| description | This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement head and manipulator have to spend traveling through all component mounting positions. The problem is defined as the traveling salesman one. The article zeroed in distance/time matrix determination for dispensing/placement head and manipulator three-dimensional movements in the case of the selected kinematics diagram of the assembly equipment. Formulas for determination of this matrix are proposed, formal description of the optimization problem is presented, and a brief review of problem-solving methods is described. |
| eu_rights_str_mv | openAccess |
| format | article |
| id | lrtest_e30df0e1c5dd0e28bc14cdc8231f186d |
| identifier_str_mv | 10.18502/keg.v2i3.1111 |
| instacron_str | U Tecnológica de Panamá |
| institution | U Tecnológica de Panamá |
| instname_str | Universidad Tecnológica de Panamá |
| language | eng |
| network_acronym_str | lrtest |
| network_name_str | lr |
| oai_identifier_str | oai:ridda2.utp.ac.pa:123456789/4347 |
| publishDate | 2017 |
| publishDateSort | 2017 |
| publisher.none.fl_str_mv | KnE Publishing |
| reponame_str | Repositorio Institucional de documento digitales de acceso abierto de la UTP |
| repository.mail.fl_str_mv | |
| repository.name.fl_str_mv | |
| repository_id_str | |
| rights_invalid_str_mv | https://creativecommons.org/licenses/by/4.0/ |
| spelling | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly ProcessA.E., KurnosenkoD.I., ArabovThis article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement head and manipulator have to spend traveling through all component mounting positions. The problem is defined as the traveling salesman one. The article zeroed in distance/time matrix determination for dispensing/placement head and manipulator three-dimensional movements in the case of the selected kinematics diagram of the assembly equipment. Formulas for determination of this matrix are proposed, formal description of the optimization problem is presented, and a brief review of problem-solving methods is described.KnE Publishing2017-10-162018-02-23T17:16:28Z2018-02-23T17:16:28Zinfo:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionapplication/pdfapplication/mswordapplication/pdfapplication/xmlhttps://knepublishing.com/index.php/KnE-Engineering/article/view/111110.18502/keg.v2i3.1111http://ridda2.utp.ac.pa/handle/123456789/4347http://ridda2.utp.ac.pa/handle/123456789/43472518-6841KnE Engineering; Breakthrough directions of Scientific Research in NRNU MEPhI: Development Perspectives in the Framework of the Strategicreponame:Repositorio Institucional de documento digitales de acceso abierto de la UTPinstname:Universidad Tecnológica de Panamáinstacron:U Tecnológica de Panamáenghttps://knepublishing.com/index.php/KnE-Engineering/article/view/1111/2640info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by/4.0/oai:ridda2.utp.ac.pa:123456789/43472021-07-06T16:47:38Z |
| spellingShingle | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process A.E., Kurnosenko |
| status_str | publishedVersion |
| title | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process |
| title_full | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process |
| title_fullStr | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process |
| title_full_unstemmed | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process |
| title_short | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process |
| title_sort | Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process |
| url | https://knepublishing.com/index.php/KnE-Engineering/article/view/1111 http://ridda2.utp.ac.pa/handle/123456789/4347 |