Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process

This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement...

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Autor principal:	A.E., Kurnosenko (author)
Altres autors:	D.I., Arabov (author)
Format:	article
Idioma:	anglès
Publicat:	2017
Accés en línia:	https://knepublishing.com/index.php/KnE-Engineering/article/view/1111 http://ridda2.utp.ac.pa/handle/123456789/4347
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