Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process

This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement...

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Bibliographische Detailangaben

1. Verfasser:	A.E., Kurnosenko (author)
Weitere Verfasser:	D.I., Arabov (author)
Format:	article
Sprache:	Englisch
Veröffentlicht:	2017
Online-Zugang:	https://knepublishing.com/index.php/KnE-Engineering/article/view/1111 http://ridda2.utp.ac.pa/handle/123456789/4347
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