Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process

This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement...

Descrizione completa

Dettagli Bibliografici

Autore principale:	A.E., Kurnosenko (author)
Altri autori:	D.I., Arabov (author)
Natura:	article
Lingua:	inglese
Pubblicazione:	2017
Accesso online:	https://knepublishing.com/index.php/KnE-Engineering/article/view/1111 http://ridda2.utp.ac.pa/handle/123456789/4347
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!